At the core of Atomic Layer Polishing (ALP®) technology is its ability to achieve ultra-smooth surfaces with sub-nanometer precision. ALP® consistently delivers surface roughness as low as less than 0.2nm RMS, far beyond the capabilities of conventional polishing techniques such as Chemical Mechanical Planarization (CMP). The smoothness achieved with ALP® is critical for industries where surface defects can compromise electrical performance, quantum coherence, or optical clarity.
- Why Surface Smoothness Matters:
In advanced applications like AI chips, quantum computing, and superconducting devices, any surface roughness at the atomic level can lead to increased quantum noise, signal interference, or degraded thermal conductivity. By polishing down to less than 0.2nm RMS, ALP® ensures that surfaces are not only defect-free but optimized for electrical conductivity and optical transmission. - Process Consistency:
One of the key advantages of ALP® is its process repeatability. ALP® can be precisely controlled to achieve consistent results across hundreds or thousands of wafers, making it ideal for high-volume semiconductor manufacturing. The ability to achieve angstrom-level smoothness repeatedly ensures that every wafer meets the stringent performance requirements of modern high-performance computing applications.