Atomic Layer Polishing™ (ALP)
Innovating at the atomic level
Our proprietary Atomic Layer Polishing™ technology delivers Angstrom-level smoothing for over 25 different substrates including copper, gallium, and silicon among others. ALP touchless technology can smooth down to <0.2nm RMS roughness on surfaces of all sizes, shapes and configurations.
- Improves semiconductor manufacturing efficiency with superior results.
- Reduces costs while increasing smoothness.
Competitive differentiators of ALP™
Ultra Smooth Surfaces for Next Generation Semiconductors
Advanced smoothing across multiple surfaces without defects.
No Stress Cracking/Beveling
ALP™ achieves surface quality through atomic level molecular interaction. ALP™ does not bevel wafer outer edges or other structures on the wafer, increasing yield.
Multiple Substrate Smoothing
ALP™ has proven smoothing of 25 key substrates and uses specially formulated and "tunable" chemicals and gasses to achieve ultra-smooth properties.
Why ALP™?
NCT®’s Atomic Layer Polishing™ (ALP) is a breakthrough solution for high-precision semiconductor surface smoothing:
- Polishes to an RMS of 0.2nm without scratches or debris, perfect for AI and Quantum Computing needs.
- Proprietary equipment supports all semiconductor polishing requirements. From In-process to Final process steps; through wafer refurbishment to reconditioning steps
- 3D polishing capability for various shapes and sizes, improving semiconductor yields.
- Eco-friendly and cost-efficient with in-process measurements for seamless integration into existing manufacturing lines.
- (Tunable chemistry) chemistry can be modified to meet specific customer needs.
Before ALP™
After ALP™
Gallium nitride (GaN) with an unpolished Root Mean Square (RMS) of 0.60nm.
ALP™ delivered a significantly smoother 0.14nm surface finish, polishing with no scratches or debris.